Method of splitting a substrate

Details Method of splitting a substrate Method of splitting a substrate

2011-08-23

2011-08-23

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S473000, C438S514000, C438S690000, C257SE21317, C257SE21318, C257SE21568

Reexamination Certificate

active

08003493

ABSTRACT:
A process for splitting a semiconductor substrate having an identification notch on its periphery, by creating a weakened zone in the substrate by implanting atomic species into the substrate while the substrate is held in place on a portion of its periphery during the implanting; and splitting the substrate along the weakened zone by placing the held portion of the substrate in a splitting-wave initiation sector while positioning the notch for initiating a splitting wave followed by the propagation of the wave into the substrate. During splitting the notch is positioned so that it is in a quarter of the periphery of the substrate diametrically opposite the sector for initiating the splitting wave or in the quarter of the periphery of the substrate that is centered on the sector.

REFERENCES:
patent: 3901423 (1975-08-01), Hillberry et al.
patent: 5854123 (1998-12-01), Sato et al.
patent: 5863830 (1999-01-01), Bruel et al.
patent: 6013563 (2000-01-01), Henley et al.
patent: 6020252 (2000-02-01), Aspar et al.
patent: 2002/0081823 (2002-06-01), Cheung et al.
patent: 2003/0134489 (2003-07-01), Schwarzenbach et al.
patent: 2004/0171233 (2004-09-01), Ohmi et al.
patent: 2005/0020030 (2005-01-01), Nakano et al.
patent: 2005/0217560 (2005-10-01), Tolchinsky et al.
patent: 1 331 663 (2003-07-01), None
patent: 1 460 691 (2004-09-01), None
International Search Report, PCT/EP2008/064200, mailed Feb. 6, 2009.

Affiliated with

Also associated with

Rating

Method of splitting a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of splitting a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of splitting a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2626044