Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-06-28
1994-06-14
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156249, 156258, 156289, 1563041, 1563043, 428 40, 428 57, 428 60, 428 61, B65H 6906
Patent
active
053206983
ABSTRACT:
Disclosed is a novel process for splicing webs of pressure sensitive laminate material. When webs of pressure sensitive laminates are spliced by conventional methods and wound into rolls, the resultant splices must be located and removed when the roll is later converted into pressure sensitive products. The novel splice is achieved by eliminating the top tape used in a conventional splice and overlapping a face sheet of one laminate web over the other laminate web to join the webs. For many processes, this novel splice is printable and does not have to be edited out, and it is at least as strong as those made with tapes. Also disclosed is a novel spliced pressure sensitive laminate.
REFERENCES:
patent: 2386344 (1945-10-01), Roesen
patent: 2726222 (1955-12-01), Palmquist et al.
patent: 3121649 (1964-02-01), Oliver
patent: 3616109 (1971-10-01), Miro et al.
patent: 3741079 (1973-06-01), Bossons et al.
patent: 4009065 (1977-02-01), Mikulas
patent: 4090003 (1978-05-01), Pierson
patent: 4464215 (1984-08-01), Cogliano
patent: 4526638 (1985-07-01), Clements
patent: 5006191 (1991-04-01), Schmidt
patent: 5039374 (1991-08-01), Winter
Fournier Richard L.
Margiloff Robert C.
DiBiase F. M.
Kane, Jr. J. W.
Osele Mark A.
S. D. Warren Company
Simmons David A.
LandOfFree
Method of splicing a pressure sensitive laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of splicing a pressure sensitive laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of splicing a pressure sensitive laminate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1246294