Method of spiral resist deposition

Details Method of spiral resist deposition Method of spiral resist deposition

1993-09-08

1995-03-07

Thomas, Tom

Fishing, trapping, and vermin destroying

427240, 118 52, 437231, H01L 21312, H01L 2147

Patent

active

053958039

ABSTRACT:
A method of depositing a material upon a substrate is disclosed. A material, such as photoresist, is deposited upon a substrate such as a semiconductor wafer by spinning the substrate and commencing deposition at the edge of the wafer and moving inward in a spiral pattern. The method produces a more uniform coating than hitherto available.

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Wolf et al., vol I, Silicon Processing for the VLSI Era, Lattice Press, l986.

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