Method of spin coating a film of non-uniform thickness

Details Method of spin coating a film of non-uniform thickness Method of spin coating a film of non-uniform thickness

2005-05-27

2010-02-16

Jolley, Kirsten C (Department: 1792)

Coating processes

Centrifugal force utilized

C427S261000, C427S402000, C427S425000, C118S052000, C118S320000, C438S758000

Reexamination Certificate

active

07662436

ABSTRACT:
Embodiments of the invention provide a method for spin coating a film onto a substrate. Preferred embodiments deposit a film, such as a resist, having a thickness gradient from the substrate's centrifugal center to its edge. The gradient may be linear or stepwise continuous, for example. Other embodiments of the invention provide a semiconductor fabrication method. The method comprises forming a resist layer having a predetermined thickness on a substrate. Preferably, the predetermining includes making swing curve measurements on a single test wafer that is coated according to embodiments of the invention.

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