Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1987-07-15
1989-02-21
Ramsey, Kenneth J.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228242, B23K 112
Patent
active
048058270
ABSTRACT:
Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid toward the sides of the component. The nozzle has downwardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board. The downwardly extending sides of the nozzle are preferably vertically oriented with respect to the printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced through a constricted space as it passes the component terminal to thus optimize transfer of heat from the fluid to the solder at the terminals.
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Coffman Bradford W.
Siegel William J.
Ferguson Jr. Gerald J.
Pace Incorporated
Ramsey Kenneth J.
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