Method of soldering using a special atmospheric gas

Details Method of soldering using a special atmospheric gas Method of soldering using a special atmospheric gas

1992-12-10

1994-03-22

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228224, H05K 334

Patent

active

052956210

ABSTRACT:
A method of soldering for surface mounting of a printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmospheric gas comprising an inert gas such as N.sub.2, Ar or He and containing about 10,000 ppm or less of oxygen and 0.5-3.0% of moisture is disclosed.

REFERENCES:
patent: 4240574 (1980-12-01), Schmatz et al.
patent: 4332342 (1982-06-01), van Der Put
patent: 4610391 (1986-09-01), Nowotarski
patent: 5071058 (1991-12-01), Nowotarski
patent: 5121875 (1992-06-01), Hagerty et al.

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