Method of soldering semiconductor part and mounted structure...

Details Method of soldering semiconductor part and mounted structure... Method of soldering semiconductor part and mounted structure...

2007-04-03

2007-04-03

Edmondson, Lynne R. (Department: 1725)

Electric heating

Metal heating

By arc

C228S180210

Reexamination Certificate

active

10710884

ABSTRACT:
A semiconductor part1in which a metal terminal2is formed on its back surface and side surface is mounted so that only the back surface portion of the metal terminal2is in contact with a cream solder3. When the side surface portion of the metal terminal2is irradiated with laser beams, the back surface portion of the metal terminal2is heated by thermal conduction from the side surface portion to the back surface portion of the metal terminal2and the cream solder3in contact with the back surface portion of the metal terminal2is melted, whereby soldering is performed.

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