Method of soldering pins to printed circuit boards, and solderin

Details Method of soldering pins to printed circuit boards, and solderin Method of soldering pins to printed circuit boards, and solderin

1981-02-20

1983-10-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 37, 228180R, B23K 306

Patent

active

044101279

ABSTRACT:
A method of soldering connection pins on carrier strips to printed circuit boards, notably to thick-film modules. Prior to soldering in a soldering bath, a printed circuit board is detachably connected to the connection pins. An endless carrier strip with the connection pins and printed circuit boards in the upright position is horizontally fed through liquid solder which flows off the components to be soldered at the surface. Solder which does not wet or connect the components flows away at the end of the predetermined soldering path, preferably in the transport direction of the parts, to a level below that of the carrier strip.

REFERENCES:
patent: 3604609 (1971-09-01), Walls
patent: 3726465 (1973-04-01), Boynton et al.
patent: 3921888 (1975-11-01), Elliott et al.
patent: 4170326 (1979-10-01), Wright
Western Electric, Technical Digest, No. 44, pp. 45-46, Oct. 1976, by Western Electric Co.

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