Electric heating – Metal heating – For bonding with pressure
Patent
1987-05-27
1988-09-13
Shaw, Clifford C.
Electric heating
Metal heating
For bonding with pressure
219 85BM, 219 85H, B23K 100
Patent
active
047711590
ABSTRACT:
A method of soldering leadless component carriers or the like to printed circuit boards uses a solder paste containing copper spheres in addition to particulate solder and flux. The solder is melted and the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.
REFERENCES:
patent: 3597285 (1971-08-01), Aronberg
patent: 3703254 (1972-11-01), Maierson et al.
patent: 4235649 (1980-11-01), Inamura et al.
patent: 4489487 (1984-12-01), Bura
GTE Government Systems Corporation
Shaw Clifford C.
Yeo J. Stephen
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