Method of soldering lead terminal to substrate

Details Method of soldering lead terminal to substrate Method of soldering lead terminal to substrate

1994-06-02

1995-09-12

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228135, 228258, H05K 334, H01R 916

Patent

active

054491100

ABSTRACT:
A method of preparing a substrate (1) having terminal electrodes (2, 3) which are provided on its both surfaces and a through hole (4), having a conductive film (5) formed on its inner peripheral surface, provided between the terminal electrodes (2, 3), mounting a lead terminal (9) having a pair of branch portions (9a, 9b) for elastically holding said terminal electrodes (2, 3) therebetween to the substrate (1), dipping the substrate (1) in molten solder from its lower surface (1b), drawing out the substrate (1) and solidifying the molten solder, thereby soldering the lead terminal (9) to the terminal electrodes (2, 3).

REFERENCES:
patent: 5297484 (1994-03-01), Piserchia et al.

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