Method of soldering including removal of flux residue

Details Method of soldering including removal of flux residue Method of soldering including removal of flux residue

1991-11-04

1992-06-30

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228242, 228175, B23K 119, B23K 35363

Patent

active

051255600

ABSTRACT:
Soldering is performed and the residues associated with the soldering process are removed through the use of a specific process. Components such as two integrated circuits or an integrated circuit and mounting board are initially tacked by compression bonding or through the use of adhesives. Flux is introduced, and the components to be soldered are brought to reflow temperature. The flux is chosen so that upon reflow and subsequent cooling to a temperature of 100.degree. C., or lower, the flux remains in liquid state. The flux is then easily removed by cleaning with a miscible liquid that is subsequently removed through processes such as spinning and evaporation.

REFERENCES:
patent: 3963529 (1976-06-01), Tsunashima
IBM Technical Disclosure Bulletin, "Prefluxing Semiconductor Chips", vol. 21, No. 6, p. 2426, Nov. 1978.
IBM Technical Disclosure Bulletin, "Method of Purging Entrapped Flux Residues from Solder Joints", vol. 30, No. 7, p. 238, Dec. 1987.
Metals Handbook, Ninth Edition, vol. 6, pp. 1081-1085, "Fluxes", copyright 1983.
D. Shoenthaler, Welding Journal Research Supplement, Nov. 1974.

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