Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1991-03-29
1993-08-03
Rowan, Kurt C.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228232, 2281801, 219390, 219497, B23K 1012, B23K 3102, H05K 334
Patent
active
052321452
ABSTRACT:
A reflow furnace in which the rate at which the temperature of the parts being processed can change can be varied throughout the furnace in order to provide a high initial rise rate, a period of low or no rise, and a very fast rise to a temperature above the melting point of solder followed by a fast drop to a temperature below the melting point of the solder. The entire operation is performed in an atmosphere of air, inert gas, active gas, or combustible gas. In a stabilization zone and a reflow zone, the primary heating mode is forced, controlled convection that is perpendicular to surface of an assembly to be soldered.
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Alley Richard C.
Carmassi Stephen E.
Daley William T.
Roffey Michael F.
Elpel Jeanne M.
Rowan Kurt C.
Schatzel Thomas E.
Watkins-Johnson Company
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