Metal fusion bonding – Process – Applying or distributing fused filler
Patent
1990-09-17
1992-01-21
Seidel, Richard K.
Metal fusion bonding
Process
Applying or distributing fused filler
228181, B23P 1300
Patent
active
050821679
ABSTRACT:
When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.
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patent: 4381390 (1983-04-01), Schmidt et al.
patent: 4521947 (1985-06-01), Nonnenmann et al.
Aoyagi Hikaru
Kasahara Akihiko
Kawasaki Takatoshi
Nakashima Yuuji
Nishizawa Yoshio
Miner James
Nippon Kinzoku Co., Ltd.
Nippon Steel Corporation
Seidel Richard K.
Toyota Jidosha & Kabushiki Kaisha
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