Method of soldering components to printed circuit boards

Details Method of soldering components to printed circuit boards Method of soldering components to printed circuit boards

1990-10-22

1992-05-12

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228227, B23K 3102

Patent

active

051119919

ABSTRACT:
The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.

REFERENCES:
patent: 2803731 (1957-08-01), Coburn
patent: 3292240 (1966-12-01), McNutt et al.
patent: 3583063 (1971-06-01), Growney
patent: 4127692 (1978-11-01), Boynton
patent: 4789096 (1988-12-01), Dunn et al.
patent: 4821948 (1989-04-01), Fisher et al.
patent: 4838475 (1989-06-01), Mullins et al.
patent: 4883214 (1989-11-01), Zimmer
Hendriks and Inpyn, "Fluxless SMD Soldering", Circuits Manufacturing, Oct. 1984, pp. 40-44.

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