Method of soldering components to at least one carrier

Details Method of soldering components to at least one carrier Method of soldering components to at least one carrier

1998-06-22

1999-12-21

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219400, 22818021, 2282341, B23K 1012, B23K 3102

Patent

active

060052244

ABSTRACT:
The invention relates to a method of connecting components (12) to at least one carrier (11), for example by soldering or gluing. Such a method is carried out in an oven (1) through which carriers are moved. Preferably, the carrier is a flexible foil. The carrier separates the oven into an upper part (2) and a lower part (3). In both parts a hot air stream (14) is created and directed toward the carrier. Owing to the separation by the foil the hot air stream in the upper part cannot reach the lower part and vice versa. The temperature of the hot air stream in the upper part differs from that (is, for example, higher than) in the lower part. The heating elements in the upper part of the oven may all have the same high temperature (for example, 240.degree. C.) and the heating elements in the lower part may all have the same low temperature (for example, 60.degree. C.). By adjusting at least one air stream the desired temperature at the location of the carriers (for example, at solder lands 17) can be obtained very rapidly (comparable with a hot/cold water mixing tap).

REFERENCES:
patent: 5180096 (1993-01-01), Kondo
patent: 5259546 (1993-11-01), Volk
patent: 5338008 (1994-08-01), Okuno et al.
patent: 5345061 (1994-09-01), Chanasyk et al.
patent: 5440101 (1995-08-01), Cox et al.
patent: 5573688 (1996-11-01), Chanasyk et al.
patent: 5683242 (1997-11-01), Cronin et al.

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