Method of soldering components to a thick-film substrate

Details Method of soldering components to a thick-film substrate Method of soldering components to a thick-film substrate

1981-03-23

1982-06-01

Weidenfeld, Gil

Metal fusion bonding

Process

Plural joints

228200, 228242, B23K 102

Patent

active

043323421

ABSTRACT:
A method of and a device for soldering components on thick-film substrates according to the reflow method. Successively, the substrates are preheated, followed by heating to the soldering temperature, after which they are cooled. A wave of molten metal of a given temperature is used for preheating, heating and cooling of the substrates.

REFERENCES:
patent: 2495150 (1950-01-01), Van Deventer
patent: 3500536 (1970-03-01), Goldschmied
patent: 3825994 (1974-07-01), Coleman

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