Method of soldering components on a carrier foil

Details Method of soldering components on a carrier foil Method of soldering components on a carrier foil

1996-07-25

1999-03-09

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2282341, B23K 1012, B23K 3102

Patent

active

058789413

ABSTRACT:
The invention relates to a method of soldering components on a carrier foil whereby hot gas is conducted onto the lower side of the carrier foil. Special soldering methods are necessary especially in SMD technology, whereby components can be soldered in large numbers on a carrier foil in a non-destructive manner both for the component itself and for the carrier foil. According to the invention, the hot gas is aimed at a soldering spot through a nozzle, heating this spot until solder heated by the hot gas flow melts on the surface of the carrier foil.

REFERENCES:
patent: 3717742 (1973-02-01), Fottler
patent: 3887997 (1975-06-01), Hartleroad et al.
patent: 3887998 (1975-06-01), Hartleroad et al.
patent: 4789096 (1988-12-01), Dunn et al.
patent: 5163599 (1992-11-01), Mishina et al.

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