Metal fusion bonding – Process – Plural joints
Patent
1986-11-06
1988-04-05
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228200, 228212, 228213, 219 85D, B23K 3100
Patent
active
047353546
ABSTRACT:
A method of soldering a component on a printed circuit board which has the steps of sucking the components supplied in an irregularly aligned disposition by a feeding sucking nozzle tube, then holding the components by a pair of holding arms of a soldering iron from right and left sides to always direct the component in a predetermined direction, placing the components at predetermined positions on a printed circuit board as in this state, melting the preliminary solder placed in advance on the board, air-cooling to solidify the solder to solder a number of components with a short time by always obtaining the desired designating direction so as not to displace the positions and to locally heat the chip components. Thus, this method can delete thermal adverse influence to the component and obviate an unintentional drop of chip components during the step of feeding the components.
REFERENCES:
patent: 3230338 (1966-01-01), Kawecki
patent: 3990863 (1976-11-01), Palmer
patent: 4437232 (1984-03-01), Araki et al.
patent: 4500032 (1985-02-01), Ackerman
patent: 4605152 (1986-08-01), Fridman
patent: 4605153 (1986-08-01), Van Den Brekel et al.
Iwata Yoshinori
Yagi Kinsaku
Godici Nicholas P.
Heinrich Samuel M.
Toyo Electronics Corp.
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