Method of soldering a sputtering target to a backing member

Details Method of soldering a sputtering target to a backing member Method of soldering a sputtering target to a backing member

1992-07-08

1993-07-27

Ramsey, Kenneth J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228256, B23K 108

Patent

active

052304620

ABSTRACT:
A method of bonding a sputtering target to a backing member or plate for subsequent use in a sputtering operation. A target and a backing plate are first provided and one face of each of the target and backing plate are wetted with solder. The target and backing plate are then submerged in a solder bath, and the wetted faces of the target and backing plate are pressed into contact. The target and backing plate are then removed from the solder bath and while maintaining them pressed together, the solder interface therebetween is cooled directionally by causing cooling to occur from the center of the solder interface radially outwardly toward the periphery. The lowermost of the target and backing plate is provided with a circumferential lip adjacent the periphery of the solder interface. When the target and backing plate are removed from the solder bath the lip acts as a solder collector and provides a solder reservoir for supplying the periphery of the solder interface with solder as the solder interface is cooled.

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