Method of soldering a light emitting device to a substrate

Details Method of soldering a light emitting device to a substrate Method of soldering a light emitting device to a substrate

1982-06-01

1985-01-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228190, B23K 3102

Patent

active

044912641

ABSTRACT:
The invention is a method of soldering a light emitting device to a substrate which uses a vee-groove to hold the substrate, solder and light emitting device in accurate alignment to one another during the melting and solidification of the solder.

REFERENCES:
patent: 3273979 (1966-09-01), Budnick
patent: 3593412 (1971-07-01), Foote
patent: 3607148 (1971-09-01), Foote
patent: 3733182 (1973-05-01), Crosslond et al.
patent: 3946334 (1976-03-01), Yonezu et al.
patent: 3996548 (1976-12-01), Chaffin
patent: 4079927 (1978-03-01), Rocton
patent: 4215319 (1980-07-01), Botez
patent: 4323327 (1982-04-01), Slack
patent: 4360965 (1982-11-01), Fujiwara

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