Metal working – Method of mechanical manufacture – Electrical device making
Patent
1980-04-03
1981-10-20
Godici, Nicholas P.
Metal working
Method of mechanical manufacture
Electrical device making
228263R, H05K 334
Patent
active
042952719
ABSTRACT:
A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components.
A method of soldering a copper lead to a lead pad on a substrate. A conductor pattern including at least one lead pad is printed on the substrate using a gold thick film paste composition. The gold composition is composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, containing by weight 98-99 percent gold particles and complementally 2-1 percent of inorganic binder particles. The binder consists essentially by total weight of gold and binder of 0.6-0.2 percent copper, 0.2 percent lead, 0.2 percent cadmium and the balance being glass. The pattern is then fired to sinter the inorganic materials, and the fired pad is presoldered without the necessity for physically or chemically precleaning the pad prior to soldering. A presoldered copper lead of an electronic component, for example, is then soldered to the presoldered pad.
REFERENCES:
patent: 3293501 (1966-12-01), Martin
patent: 3746568 (1973-07-01), Rybarczyk
patent: 3776769 (1973-12-01), Buck et al.
patent: 3960777 (1976-06-01), Coyle
patent: 3970590 (1976-07-01), Hoffman et al.
patent: 4032350 (1977-06-01), Greenstein
Solders and Soldering by H. H. Manko, McGraw-Hill Book Co. (1964), pp. 102, 103, 124, 125, 180, 181, 182, 219-221, 288-290.
Gold Thick Film Conductors by M. V. Coleman and G. E. Gurnett, Gold Bull. 77, 10(3) 74-75.
Lam Man K.
Mones Arthur H.
Neuhoff Donald
Arbes C. J.
Godici Nicholas P.
Holloway, Jr. W. W.
Honeywell Information Systems Inc.
Hughes E. W.
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