Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1995-06-15
1997-04-15
Bradley, P. Austin
Metal fusion bonding
Process
With protecting of work or filler or applying flux
22818022, 228254, B23K 3102, B23K 3706
Patent
active
056201311
ABSTRACT:
During formation of solder bumps on the bonding pads of a component, a two-layer dam structure is utilized to block solder from flowing from the pads to adjacent portions of a metallization pattern. After the solder bumps are formed, the top dam layer is dissolved, whereby any solder debris present on the top dam layer is also removed from the structure. The bottom dam layer, which remains intact during the removal step, serves to confine solder movement during a subsequent bonding operation in which the solder bumps are reflowed to cause them to adhere to aligned pads on another component.
REFERENCES:
patent: 5162257 (1992-11-01), Yung
patent: 5496770 (1996-03-01), Park
patent: 5536677 (1996-07-01), Hubacher
"Self-Limited C4 Process," IBM Tech. Discl. Bull., vol. 36, No. 10, Oct. 1993, pp. 265-266.
Kane Casey F.
Shmulovich Joseph
Bradley P. Austin
Knapp Jeffrey T.
Lucent Technologies - Inc.
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