Method of smoothing the outline of a useful layer of...

Details Method of smoothing the outline of a useful layer of... Method of smoothing the outline of a useful layer of...

2005-10-25

2005-10-25

Kielin, Erik (Department: 2813)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S455000, C438S459000

Reexamination Certificate

active

06958284

ABSTRACT:
A method of providing a regular outline in a useful layer of material that is transferred from a source substrate onto a support substrate during the fabrication of a composite substrate for subsequent use in electronics, optics, or optoelectronics. The technique includes providing a shoulder on a front face of one of the source or support substrates about its periphery. The shoulder defines an inner projecting zone that has a top face, a sidewall and a regular outline. Next, the method includes molecularly bonding the top face of the projecting zone to a receiving face of the other of the source or support substrates, and removing a portion of the projecting zone from the source substrate to provide the useful layer having the regular outline on the support substrate.

REFERENCES:
patent: 5152857 (1992-10-01), Ito et al.
patent: 5597410 (1997-01-01), Yen
patent: 6093623 (2000-07-01), Forbes
patent: 6309950 (2001-10-01), Forbes
patent: 6417108 (2002-07-01), Akino et al.
patent: 6538330 (2003-03-01), Forbes
patent: 6566235 (2003-05-01), Nishida et al.
patent: 2001/0055854 (2001-12-01), Nishida et al.
patent: 2003/0008478 (2003-01-01), Abe et al.
patent: 0451993 (1991-10-01), None
patent: 1059663 (2000-12-01), None
patent: 1 189 266 (2002-03-01), None
patent: WO 01/73831 (2001-10-01), None

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