Method of smelting copper

Details Method of smelting copper Method of smelting copper

2011-04-05

2011-04-05

Wyszomierski, George (Department: 1733)

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

C075S010350

Reexamination Certificate

active

07918917

ABSTRACT:
A method of smelting copper includes: a generating step of generating blister and calcium ferrite slag from copper matte by charging the copper matte into a smelting furnace and oxidizing the copper matte; and a refining step of refining another blister from the calcium ferrite slag in an electrical furnace under a temperature condition of 1250 degrees C. to 1350 degrees C. and under a reductive atmosphere condition of oxygen partial pressure logPO2≦−9.3.

REFERENCES:
patent: 4006010 (1977-02-01), Rajcevic et al.
patent: 4144055 (1979-03-01), Petersson et al.
patent: 6761749 (2004-07-01), Poijarvi et al.
patent: 57-41333 (1982-03-01), None
patent: 57-192232 (1982-11-01), None
patent: 11-21835 (1999-01-01), None
patent: 2003-213347 (2003-07-01), None
Kojo et al., “Outokumpu Blister Smelting Processes-Clean Technology Standards”, Cu2007, The proceddings of the Carlos Diaz Symposium on Pyrometallurgy, Toronto, Canada, 2007, vol. 3, Book 2, pp. 183-190.
Tuominen et al., “Slag Cleaning of Outokumpu Direct-To-Blister Flash Smelting Slags”, Cu2007, The proceedings of the Carlos Diaz Symposium on Pyrometallurgy, Toronto, Canada, 2007, vol. 3, Book 2, pp. 339-350.
Office Action dated Aug. 3, 2010 issued in corresponding Japanese patent application No. 2008-227127 (with English translation).

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