Method of slicing semiconductor crystal

Details Method of slicing semiconductor crystal Method of slicing semiconductor crystal

1987-12-16

1989-04-11

Olszewski, Robert P.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51 5D, 51325, 125 13R, B24B 2706

Patent

active

048193879

ABSTRACT:
A mounting beam is described having a V-shaped surface capable of having various sizes of semiconductor crystals mounted thereon. This mounting beam is comprised of either: a graphite material mixed with aluminum oxide or silicon carbide; or a graphite body having dressing sticks disposed therein. During the slicing process, when a slicing blade cuts through the crystal into the mounting beam, the blade will be dressed by the sticks or the mounting beam itself.

REFERENCES:
patent: 2709384 (1955-05-01), Harris
patent: 4227348 (1980-10-01), Demers
patent: 4228782 (1980-10-01), Demers et al.
patent: 4420909 (1983-12-01), Steere, Jr.
patent: 4465268 (1984-08-01), Hudson
patent: 4667650 (1987-05-01), Girard et al.

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