Method of singulating electronic devices

Details Method of singulating electronic devices Method of singulating electronic devices

2004-10-27

2008-09-09

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S458000, C438S460000, C438S462000, C257SE21599

Reexamination Certificate

active

07422962

ABSTRACT:
A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid street is disposed over the bond pad. In addition, the method also includes sawing partially through the lid street to form a trench in the lid street. The trench includes a trench bottom in the lid substrate.

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