Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1981-10-14
1984-04-17
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228180A, B23K 3100
Patent
active
044429665
ABSTRACT:
A method for the simultaneous manufacture of multiple electrical connections, in particular for the electrical connection of semiconductor elements. In the method a conductive paste is used. Because the conductive paste would otherwise provide a poor electrical connection with the contact pads which are manufactured of certain metals, the paste is first polymerized and thermo-compression of the paste is then carried out on the contact pad by the simultaneous application of pressure and a rise in temperature so that the paste forms a readily conductive and reliable connection.
REFERENCES:
patent: 3463698 (1969-08-01), Yanagihara
patent: 3697308 (1972-10-01), Lubowitz
patent: 4127699 (1978-11-01), Aumiller
patent: 4147669 (1979-04-01), Shaheen
patent: 4233103 (1980-11-01), Shaheen
Florens, deceased Georges E.
Jourdain Philippe
Souquet, representative Georges A. L.
Biren Steven R.
Briody Thomas A.
Godici Nicholas P.
Hodak Marc
Mayer Robert T.
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