Metal treatment – Compositions – Heat treating
Patent
1978-01-31
1980-07-01
Rutledge, L. Dewayne
Metal treatment
Compositions
Heat treating
148187, 357 23, 357 29, 357 91, H01L 21263, C03C 304
Patent
active
042104645
ABSTRACT:
The whole body of a semiconductor device with its pn junction exposed ends covered by insulating glass is subjected to the exposure to radiation having an energy of higher than 0.5 MeV in terms of the reduced energy of electron beams while the semiconductor device is maintained at temperatures higher than 300.degree. C., and preferably higher than 350.degree. C. As a result, the life time of the minority carriers in the semiconductor device can be shortened without increasing the leakage current in the reverse direction.
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Ogawa Takuzo
Okamura Masahiro
Shirasawa Toshikatsu
Tanaka Tomoyuki
Hitachi , Ltd.
Roy Upendra
Rutledge L. Dewayne
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