Method of SiC single crystal growth and SiC single crystal

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth with a subsequent step acting on the...

Reexamination Certificate

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C117S003000, C117S109000, C117S937000

Reexamination Certificate

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07837789

ABSTRACT:
A method of epitaxial growth of a 4H—SiC single crystal enabling growth of an SiC single crystal with low defects and low impurities able to be used for a semiconductor material at a practical growth rate, comprising growing a 4H—SiC single crystal on a 4H—SiC single crystal substrate by epitaxial growth while inclining an epitaxial growth plane of the substrate from a (0001) plane of the 4H—SiC single crystal by an off-angle of at least 12 degrees and less than 30 degrees in a <11-20> axial direction, and a 4H—SiC single crystal obtained by the same.

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Jul. 13, 2010 Japanese Office Action issued in Japanese Patent Application No. 2004-145179 with English translation.

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