Method of shielding and obtaining access to a component on a pri

Details Method of shielding and obtaining access to a component on a pri Method of shielding and obtaining access to a component on a pri

1998-06-02

2000-10-24

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156252, 156268, 156257, 174 35R, 257660, 225 93, 83 33, 428 43, 428901, B32B 3100, H05K 900

Patent

active

061361313

ABSTRACT:
A method for shielding and obtaining access to a component on a printed circuit board including providing a printed circuit board having a component encompassed by a shielding enclosure including a plurality of side walls and an integral top surface having a scored line which defines an interior portion, severing the scored line, removing the interior portion leaving the shielding enclosure with a remaining perimeter rim and allowing access to the component, providing a replacement cover for the shielding enclosure, and attaching the replacement cover to the shielding enclosure to replace the interior portion and to thereby encompass and shield the component. The replacement cover may be attached by soldering or by an adhesive surface of the replacement cover.

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Leader Tech Brochure, "Style CBS Circuit Board Component Shielding," Mar. 1992, pp. 1-11.
Instrument Specialties Catalog, "Engineering Design and Shielding Product Selection Guide," pp. 76 & 77, Apr. 1998.
Zuber, W., "Automated Manufacturing RF-Shielding and Sealing," Motorola Technical Developments, Motorola, Inc., May 1996, pp. 190-191.

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