Method of shaping inter-substrate plug and receptacles interconn

Details Method of shaping inter-substrate plug and receptacles interconn Method of shaping inter-substrate plug and receptacles interconn

1994-01-04

1995-10-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Roller making

29830, 1566301, 1566331, 437192, H01L 2170

Patent

active

054578795

ABSTRACT:
A method electrically and mechanically interconnects two surfaces of high density first and second semiconductor devices. The first semiconductor device (10) is formed with plug members (22) connected to nodes (18) of its circuit elements (14) and protruding from the first semiconductor device. The second semiconductor device (24) is formed having receptacle members (36) connected to nodes (32) of its circuit elements (28) and protruding from the second semiconductor device. The plug members are inserted into the receptacle member to interconnect the first and second semiconductor devices. The plug members may be removed from the receptacle member to disconnect the first and second semiconductor devices.

REFERENCES:
patent: 4612554 (1986-09-01), Poleshuk
patent: 4952272 (1990-08-01), Okino et al.
patent: 4963511 (1990-10-01), Smith
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5108541 (1992-04-01), Schneider et al.

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