Etching a substrate: processes – Adhesive or autogenous bonding of two or more...
Patent
1995-07-12
1997-09-09
Dang, Thi
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
216 53, 216 96, B29D 1100, B29D 2500
Patent
active
056652526
ABSTRACT:
The method of shaping a polycrystalline diamond (PCD) body (exemplarily a wafer of CVD-PCD) utilizes our discovery that the rate and amount of diamond removal from a given region of a PCD body depends, for a given metal "etchant" at a given temperature, on the thickness of the etchant layer overlying the given region, with relatively larger etchant thickness being associated with relatively higher removal rate and amount. Exemplarily, the method can be used to substantially remove thickness variations and/or film curvature from as-produced PCD films. An exemplary metal that can be used in the practice of the invention is mischmetal. The metal etchant can be molten, partially molten or solid.
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"Diamonds Polished by Solid State Diffusion," by W. van Enckevort, Physics World, Aug. 1992, pp. 22-23.
"Thinning and Patterning of CVD Diamond Films by Diffusional Reaction," by S. Jin et al., Diamond and Related Materials, vol. 2 (1993), pp. 1038-1042.
"Massive Thinning of Diamond Films by a Diffusion Process," by S. Jin et al., Applied Physics Letters, vol. 60(16), Apr. 20, 1992, pp. 1948-1950.
"Shaping of Diamond Films by Etching with Molten Rare-Earth Metals," by S. Jin., Nature, vol. 362, Apr. 29, 1993, pp. 822-824.
Jin Sung-ho
Zhu Wei
Dang Thi
Lucent Technologies - Inc.
Pacher Eugen E.
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