Method of severing a thin film semiconductor device

Details Method of severing a thin film semiconductor device Method of severing a thin film semiconductor device

1992-05-11

1997-06-10

Tsai, Jey

Semiconductor device manufacturing: process

Semiconductor substrate dicing

148DIG28, H01L 21302, H01L 21463

Patent

active

056375379

ABSTRACT:
A method of severing a thin film semiconductor device. The semiconductor device includes a substrate having a first electrode region formed thereon, a semiconductor body formed of layers of thin film semiconductor alloy material disposed upon the base electrode, a transparent, electrically conductive second electrode deposited atop the semiconductor body, and a containment layer of polymeric material associated with the first or second electrode in at least one region to permit subsequent severing of the device into a plurality of devices through said containment layer region.

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