Method of severing a semiconductor device

Details Method of severing a semiconductor device Method of severing a semiconductor device

1985-04-01

1987-11-03

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 2, H01L 21463

Patent

active

047043695

ABSTRACT:
An improved method for severing a large area semiconductor device, including a substrate having a base electrode region thereupon, semiconductor body and top electrode into smaller area devices includes the steps of supporting the semiconductor device from the top electrode side thereof and applying a cutting force to the substrate side of the semiconductor device so as to cut the device without establishing short circuit contact between the substrate electrode and the top electrode thereof. Also included is a large area semiconductor device having a protective layer affixed to the top electrode surface thereof. The large area device is readily adapted for severing into smaller area photovoltaic devices by the method disclosed herein.

REFERENCES:
patent: 2444255 (1948-06-01), Hewlett
patent: 2479446 (1949-08-01), Wilson
patent: 2743506 (1956-05-01), Solow
patent: 3015374 (1962-01-01), Crouthamel
patent: 4245386 (1981-01-01), Kausche et al.
patent: 4419530 (1983-12-01), Nath
patent: 4485264 (1984-11-01), Iyu et al.

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