Method of sequential laser processing to efficiently manufacture

Details Method of sequential laser processing to efficiently manufacture Method of sequential laser processing to efficiently manufacture

1996-11-08

1999-06-08

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 20, 216 65, 428209, B44C 122

Patent

active

059102551

ABSTRACT:
A method for forming a blind-via in a laminated substrate by laser drilling a blind-via from a top surface of the substrate toward a bottom surface of the substrate using a first laser and a first trepanning motion of a laser focal spot of the first laser. Then, the via is laser drilled from the top surface toward the bottom surface using a second laser and a second trepanning motion of a laser focal spot of the second laser.

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