Method of separating wafers into individual die

Details Method of separating wafers into individual die Method of separating wafers into individual die

1997-07-10

2000-09-12

Stinson, Frankie L.

Etching a substrate: processes

Mechanically shaping, deforming, or abrading of substrate

438462, 438465, 438113, 438460, 216 17, 216 65, H01L 21786

Patent

active

061173479

ABSTRACT:
A method of separating a wafer into individual die is disclosed. The wafer includes a substrate with organic thin-film multiple layers. A portion of the organic multiple layers is etched along a scribe line with excimer laser to form a groove to expose a portion of the substrate before sawing the substrate along the scribe line with a saw blade. Plasma etching or ion beam etching or sand blasting is an alternative to the excimer laser.

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"Method of Preventing Damage to Integrated Circuit Chips During Wafer Dicing", IBM Technical Disclosure Bulletin, vol. 34, No. 12, May 1, 1992, pp. 311-312.

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