Method of separating slice base mounting member from wafer and j

Details Method of separating slice base mounting member from wafer and j Method of separating slice base mounting member from wafer and j

1995-10-23

2000-06-13

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

438115, H01L 2130, H01L 2164, H01L 2168

Patent

active

060744421

ABSTRACT:
An method of separating a slice base mounting member such as a carbon member from sliced wafers, and an jig which is used for treating the wafers in the method, are disclosed. The method of separating a slice base mounting member from sliced wafers comprises the steps of; supporting a plurality of wafers having at least a slice base mounting member in a stacked state, and separating the slice base mounting member from the stacked wafers.

REFERENCES:
patent: 4488930 (1984-12-01), Koe
patent: 4510672 (1985-04-01), Yakura
patent: 4949700 (1990-08-01), Ebashi
patent: 5154873 (1992-10-01), Sato et al.
patent: 5240882 (1993-08-01), Satoh et al.
patent: 5427644 (1995-06-01), Nagatsuka et al.
patent: 5524604 (1996-06-01), Honda
patent: 5571040 (1996-11-01), Kawaguchi et al.

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