Method of separating micro-devices formed on a substrate

Metal working – Method of mechanical manufacture – Utilizing transitory attached element or associated separate...

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29412, 438114, 438465, 125 1602, 451 53, B23P 1700, H01L 2178

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active

058325859

ABSTRACT:
A method of separating a plurality of micro-devices from one another which are formed in a predetermined pattern on a single substrate is disclosed herein. Each micro-device includes at least one predetermined area to be protected from process debris during the separating process. The method includes the step of first coating the micro-devices with a water soluble material such that at least the predetermined area is covered. Following coating, the micro-devices are separated from one another such that the water soluble material continues to cover the predetermined area. Next, the micro-devices and the water soluble material are exposed to water which substantially removes the water soluble material from the predetermined area without harming the micro-devices such that contamination of the predetermined area by the process debris is prevented during the separating step.

REFERENCES:
patent: 2818696 (1958-01-01), Pigott
patent: 2851764 (1958-09-01), White
patent: 3699644 (1972-10-01), Cocca
patent: 4016855 (1977-04-01), Mimata
patent: 4612211 (1986-09-01), Hawrylo et al.
patent: 5306370 (1994-04-01), Herko et al.
patent: 5362681 (1994-11-01), Roberts et al.
patent: 5393706 (1995-02-01), Mignardi et al.
patent: 5461008 (1995-10-01), Sutherland et al.
patent: 5516728 (1996-05-01), Degani et al.
patent: 5593926 (1997-01-01), Fujihara
patent: 5622900 (1997-04-01), Smith

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