Method of separating electronic devices contained in a carrier

Details Method of separating electronic devices contained in a carrier Method of separating electronic devices contained in a carrier

1997-02-07

1998-08-04

Picardat, Kevin

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438460, H01L 2160

Patent

active

057893071

ABSTRACT:
A method of separating electronic devices contained in a carrier which are provided at the surface of the carrier and are covered by a protective layer. Openings are provided above separation regions between adjacent electronic devices. The material of the carrier is removed in the separation regions starting from the openings, and the electronic devices are, at least during the material-removing process, confined in the carrier by respective regions with a material removal property different from that of the carrier.

REFERENCES:
patent: 4729971 (1988-03-01), Coleman
patent: 5179035 (1993-01-01), Shannon
patent: 5597767 (1997-01-01), Mignardi et al.

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