Method of separating a mold from a solidified layer disposed...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

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C264S319000, C977S887000

Reexamination Certificate

active

07635445

ABSTRACT:
The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.

REFERENCES:
patent: 4391511 (1983-07-01), Akiyama et al.
patent: 4932358 (1990-06-01), Studley et al.
patent: 5364222 (1994-11-01), Akimoto et al.
patent: 5515167 (1996-05-01), Ledger et al.
patent: 5534073 (1996-07-01), Kinoshita et al.
patent: 5563684 (1996-10-01), Stagaman
patent: 5612068 (1997-03-01), Kempf et al.
patent: 5737064 (1998-04-01), Inoue et al.
patent: 5900062 (1999-05-01), Loewenhardt et al.
patent: 6019166 (2000-02-01), Viswanath et al.
patent: 6137562 (2000-10-01), Masuyuki et al.
patent: 6160430 (2000-12-01), Drapkin
patent: 6220561 (2001-04-01), Garcia
patent: 6304424 (2001-10-01), Mett et al.
patent: 6407006 (2002-06-01), Levert et al.
patent: 6512401 (2003-01-01), Clark et al.
patent: 6809802 (2004-10-01), Tsukamoto et al.
patent: 6898064 (2005-05-01), Bernam et al.
patent: 6921615 (2005-07-01), Sreenivasan et al.
patent: 6951173 (2005-10-01), Meissl et al.
patent: 6965506 (2005-11-01), Howald
patent: 6980282 (2005-12-01), Choi et al.
patent: 7023238 (2006-04-01), Camarota
patent: 7259833 (2007-08-01), Nimmakayala et al.
patent: 2002/0018190 (2002-02-01), Nogawa et al.
patent: 2002/0098426 (2002-07-01), Sreenivasan et al.
patent: 2003/0092261 (2003-05-01), Kondo et al.
patent: 2003/0166814 (2003-09-01), Sparrowe et al.
patent: 2003/0179354 (2003-09-01), Araki et al.
patent: 2004/0112861 (2004-06-01), Choi et al.
patent: 2005/0046449 (2005-03-01), Davis
patent: 2005/0160934 (2005-07-01), Xu et al.
patent: 2005/0263077 (2005-12-01), GanapathiSubramanian et al.
patent: 2006/0172031 (2006-08-01), Babbs et al.
patent: 2006/0172553 (2006-08-01), Choi et al.
patent: 2006/0177532 (2006-08-01), Fletcher et al.
patent: 2006/0177535 (2006-08-01), McMackin et al.
patent: 2007/0170617 (2007-07-01), Choi et al.
patent: 2007/0190200 (2007-08-01), Cherala et al.
patent: 2007/0243279 (2007-10-01), McMackin et al.
patent: 0398589 (1998-04-01), None
Feldman, Wafer Chuck for Magnification Correction in X-ray Lithography, J. Vac. Sci. Technol. B 16(6), pp. 3476-3479 Nov. 1, 1998.
U.S. Appl. No. 11/047,428, naming Inventors Babbs et al., entitled Chucking System for Nano-Manufacturing, filed Jan. 31, 2005.
U.S. Appl. No. 11/047,499, naming Inventors Choi et al., entitled Method of Retaining a Substrate to a Wafer Chuck, filed Jan. 31, 2005.
U.S. Appl. No. 11/136,886, naming Inventors Nimmakayala et al., entitled Substrate Support Method, filed May 25, 2005.
U.S. Appl. No. 11/136,892, naming Inventors GanapathiSubramanian et al., entitled Adaptive Shape Substrate Support Method, filed May 25, 2005.
U.S. Appl. No. 11/837,762, naming Inventors Nimmakayala et al., entitled Substrate Support Method, filed Aug. 13, 2007.
PCT/US2006/001160 International Search Report, Jun. 12, 2008.

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