Method of sensitizing copper surfaces with sensitizing solution

Details Method of sensitizing copper surfaces with sensitizing solution Method of sensitizing copper surfaces with sensitizing solution

1977-12-16

1979-05-08

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 111, 427305, 427306, 427 98, C23C 302

Patent

active

041537467

ABSTRACT:
A method of sensitizing surfaces which at least include areas of copper for subsequent electroless plating wherein the surface to be sensitized is processed with a sensitizing bath which includes precious metal ions, stannous ions in stoichiometric surplus, a haloid acid, and a complex forming compound for copper ions.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3627558 (1971-12-01), Roger et al.
patent: 3650959 (1972-03-01), Shipley et al.
patent: 3672938 (1972-06-01), Zeblisky

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