Method of semiconductor packaging and/or a semiconductor...

Details Method of semiconductor packaging and/or a semiconductor... Method of semiconductor packaging and/or a semiconductor...

2011-05-10

2011-05-10

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S112000, C438S126000

Reexamination Certificate

active

07939381

ABSTRACT:
The method includes forming a leadframe. The leadframe is directly bonded to the semiconductor chip. The leadframe is flexed and/or compressed in a mold cavity. The compressed leadframe and the chip are molded into a package.

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