Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2008-04-24
2010-10-05
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
C438S011000, C438S018000, C257S048000, C257S704000, C257SE21521, C257SE21524
Reexamination Certificate
active
07807481
ABSTRACT:
A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
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Fukuda Keisuke
Kohashi Naohito
Maruyama Shigeyuki
Tashiro Kazuhiro
Fujitsu Semiconductor Limited
Huynh Andy
Westmean, Hattori, Daniels & Adrian, LLP
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