Method of selectively soldering the underside of a substrate hav

Details Method of selectively soldering the underside of a substrate hav Method of selectively soldering the underside of a substrate hav

1985-09-09

1987-08-04

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

427 96, 228254, 228 563, B23K 3102

Patent

active

046840559

ABSTRACT:
A method for soldering the underside of a substrate between leads. A paste of solder emulsified in a flux material is printed onto a carrier and film. The paste is adhered to the film by drying or reflowing before being placed onto the substrate between the projecting leads. The substrate and film are then heated. The molten solder having an affinity for plated surface areas of the substrate and no affinity for the polyimide film transfers and self-aligns to the plated surfaces of the substrate. The method allows selective soldering of the underside surface of a substrate having leads without soldering these leads, or selective soldering of some plated areas of a substrate while leaving other plated areas free of solder.

REFERENCES:
patent: 3726007 (1973-04-01), Keller
patent: 3950200 (1976-04-01), Muramoto et al.
patent: 4304640 (1981-12-01), Walker
patent: 4327124 (1982-04-01), Des Marais
patent: 4332341 (1982-06-01), Minetti
patent: 4339784 (1982-07-01), Shearer
patent: 4442966 (1984-04-01), Jourdain et al.

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