Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Internal battery action
Reexamination Certificate
2011-05-03
2011-05-03
Neckel, Alexa D. (Department: 1723)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
Internal battery action
C205S640000, C205S676000
Reexamination Certificate
active
07935242
ABSTRACT:
An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with the surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.
REFERENCES:
patent: 5247954 (1993-09-01), Grant et al.
patent: 5733432 (1998-03-01), Williams et al.
patent: 5989470 (1999-11-01), Doan et al.
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6316364 (2001-11-01), Kubo
patent: 6709565 (2004-03-01), Mayer et al.
patent: 6773476 (2004-08-01), Sakai et al.
patent: 6811680 (2004-11-01), Chen et al.
patent: 6858091 (2005-02-01), Boyd et al.
patent: 6858531 (2005-02-01), Zhu et al.
patent: 6899804 (2005-05-01), Duboust et al.
patent: 6902628 (2005-06-01), Wang et al.
patent: 6967118 (2005-11-01), Weng et al.
patent: 6967166 (2005-11-01), Basol et al.
patent: 7012025 (2006-03-01), Sun et al.
patent: 7074113 (2006-07-01), Moore
patent: 7112122 (2006-09-01), Lee et al.
patent: 7129160 (2006-10-01), Chopra
patent: 7153777 (2006-12-01), Lee
patent: 7167353 (2007-01-01), Yuyama et al.
patent: 2003/0181345 (2003-09-01), Bian
patent: 2005/0020192 (2005-01-01), Lee et al.
patent: 2005/0066585 (2005-03-01), Bian et al.
patent: 2005/0070211 (2005-03-01), Bian
patent: 2005/0097825 (2005-05-01), Bian
patent: 2005/0274617 (2005-12-01), Bryning
patent: 2005/0282390 (2005-12-01), Bian et al.
patent: 2006/0019132 (2006-01-01), Lipilin et al.
patent: 2006/0035564 (2006-02-01), Novak et al.
patent: 2007/0251418 (2007-11-01), Magee et al.
Ionic liquid, from Wikipedia, the free encyclopedia, http://en.wikipedia.org/wiki/Ionic—liquid, Jan. 26, 2006.
Ionic liquid, http://www.organic-chemistry.org/topics/ionic-liquids.shtm, Jan. 26, 2006.
Collins Dale W.
Greeley Joseph N.
Klein Rita J.
Morgan Paul
Sinha Nishant
Micro)n Technology, Inc.
Neckel Alexa D.
Smith Nicholas A.
Whyte Hirschboeck Dudek SC
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