Method of selectively removing a metallic layer from a non-metal

Details Method of selectively removing a metallic layer from a non-metal Method of selectively removing a metallic layer from a non-metal

1996-11-22

1998-06-02

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 65, 216 78, 216 75, 216 77, B44C 122, C23F 100

Patent

active

057594163

ABSTRACT:
A method of selectively removing a metallic layer (3) from a non-metallic substrate (1) includes the steps of arranging for the metallic layer (3) to be overlaid by a coating (7) of Sn-rich metallic material, and directing a laser beam of wavelength .lambda. onto a selected area (5') of the coating (7), .lambda. being chosen to lie in the range 450-650 nm, thereby causing localized heating of the coating (7) in this area (5') and consequent ablative removal of the underlying portion of the metallic layer (3). The method is particularly useful in the manufacture of printed circuit boards.

REFERENCES:
patent: 4498925 (1985-02-01), Cline
patent: 4786358 (1988-11-01), Yamazaki et al.
patent: 4943346 (1990-07-01), Mattelin
patent: 5509553 (1996-04-01), Hunter et al.

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