Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-02-23
1999-11-09
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156234, 156239, 156240, B44C 1165
Patent
active
059806796
ABSTRACT:
A method of selectively metallizing a thermoplastic substrate using a hot foil embossing technique, a patterned metal layer being transferred to the substrate from a metal foil by a cutting and pressing procedure including steps (a) and (b). In step (a) the patterned metal layer is first cut from the foil using a punch-press at a selected pressure p.sub.a. In step (b) the cut patterned metal layer is then attached to the substrate using a press at a pressure p.sub.b which is .ltoreq.10 N/mm.sup.2 and also <p.sub.a, and a temperature T.sub.b .gtoreq.100.degree. C. This avoids concurrent application of high pressure and high temperature, which could cause formation of upset edges at the surface of the substrate.
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Meeuwsen Franciscus A.
Severin Jan W.
Lorengo J. A.
Mayes Curtis
Tierney Daniel E.
U.S. Philips Corporation
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