Method of selectively electroplating the nodes of dimpled titani

Details Method of selectively electroplating the nodes of dimpled titani Method of selectively electroplating the nodes of dimpled titani

1983-04-25

1984-03-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, C25D 502

Patent

active

044365926

ABSTRACT:
A process for selectively electroplating the nodes of dimpled titanium material. A sheet of clean dimpled titanium material is placed on a electrolyte saturated absorbent fabric covered block of conductive material. A flat sheet of metal, such as, stainless steel is placed on the opposite surface of the dimpled sheet to provide dead weight to hold only the nodes of the dimpled sheet in contact the absorbent material the dimpled sheet serving as one electrode for the electroplating process. The conductive block being the other electrode. Current is then passed through the electrolyte solution between the electrodes causing only the nodes to become plated. The electrolyte may contain, for example, copper or nickel in solution. A plating mask in the form of a frame may be placed between the flat sheet of metal and the dimpled sheet to provide uniform plating of the node surfaces. The process is repeated for the opposite side of the dimpled sheet and for successive layers of the same or different plating solution.

REFERENCES:
patent: 1739657 (1929-12-01), Shemitz
patent: 2540602 (1951-02-01), Thomas
patent: 3061526 (1962-10-01), Skolnick
patent: 3745105 (1973-07-01), Kosowsky
patent: 4001093 (1977-01-01), Koontz

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