Method of selectively depositing a metal on a surface by means o

Details Method of selectively depositing a metal on a surface by means o Method of selectively depositing a metal on a surface by means o

1981-08-07

1982-10-19

Demers, Arthur P.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

427304, 361397, C23C 1500

Patent

active

043549110

ABSTRACT:
It has been discovered that by cleaning a substrate having a negative ink pattern of a desired circuit in a plasma comprising 60/40 oxygen/argon and then sputtering a thin (10-50 Angstroms) layer of catalytic copper thereover, the treated substrate when exposed to an electroless plating bath will selectively plate only in the areas where there is no ink.

REFERENCES:
patent: 4121015 (1978-10-01), McPherson
patent: 4157936 (1979-06-01), Piazza
patent: 4243700 (1981-01-01), Piazza

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