Method of selective via-hole and heat sink plating using a metal

Details Method of selective via-hole and heat sink plating using a metal Method of selective via-hole and heat sink plating using a metal

1988-05-10

1989-06-27

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

048426997

ABSTRACT:
A method for simultaneous selective plating of viaholes and heat sinks associated with a semiconductor wafer using a metal mask and comprising the steps of:

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